SAN JOSE, Calif.--SBA Materials Inc., a leader in development of engineered nano-structured dielectrics, has announced the successful closing of its Series D financing round. New investors in this round were Air Liquide Venture Capital (ALIAD) and Tokyo Electron Venture Capital Inc. Also participating were existing investors Intel Capital, Samsung Venture Investment Corporation and Sun Mountain Capital.
SBA plans to use the proceeds to continue efforts towards customer qualification and commercialization of its Liquid Phase Self Assembly (LPSA) based ultra low-k dielectric coatings for semiconductor manufacturing, strengthen relationships and partnerships with leading semiconductor supply chain ecosystem participants, and extend its investigation of new application areas.
“We are delighted to take a minority stake in SBA Materials, an innovative technology start-up developing improved dielectric materials for the semiconductor industry,” said Pierre-Etienne Franc, VP Advanced Business & Technologies of Air Liquide and CEO of ALIAD.
“We are very excited to have ALIAD and TEL Ventures, representing leading strategic companies in the semiconductor industry supply chain, join as our newest investors,” said Hash Pakbaz, President and CEO of SBA Materials Inc. “Their participation, along with our current strategic investors, will enable SBA to carry out its strategy toward commercializing its disruptive LPSA dielectric at a time where the industry faces great challenges with extending Moore’s law, processor power consumption and speed with clear needs for enabling materials.”
About Air Liquide Venture Capital (ALIAD):
ALIAD is Air Liquide Venture Capital
About SBA Materials: www.sbamaterials.com
SBA Materials (San Jose, CA) is a leader in development of nano-porous dielectrics. SBA's patented Liquid Phase Self Assembly technology enables the design of advanced siloxane-based materials with a broad range of porosities and a unique combination of electrical, optical and mechanical properties. This unique class of materials has applications in significant markets ranging from high performance logic chips to energy storage. SBA’s liquid processable low-k dielectric has the potential to improve the performance of advanced micro-processors while significantly reducing their power consumption.