Saki Corporation has added a new extra component detection (ECD) feature to its BF-3Di 3D automated optical inspection (AOI) systems.
Saki's ECD algorithm inspects for stray components, solder balls, and foreign materials across the entire surface of the circuit board and can detect objects of 200 microns or less, thereby eliminating these defects. ECD, coupled with the benefits of the complete scan of the PCB by Saki's line scan technology, provides further assurance of product quality. Saki's ECD is incorporated into both its 2D and 3D AOI systems.
Saki's systems handle all types of boards, including extra-large (686x870mm) PCBs. The BF-3 Di series uses multi-phase ring lighting and Saki's proprietary coaxial top light illumination to measure the solder height and accurately reconstruct the fillet geometry of the image. With the newly developed 4-way side cameras, it accurately detects J-leads, QFN packages, and connector assemblies via 4-way projection technology. These systems measure heights from 0-20mm with 1µm resolution and achieve full automation with very low false calls and zero escapes. In addition, Saki's BF-3 Di software reduces library creation time by over 50% when compared to conventional AOI machines.
Saki Corporation is displaying this technology NEPCON China on April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center in Shanghai, China, in booth 1J25.