SAN FRANCISCO--(BUSINESS WIRE)--Rambus Inc.:
|Rambus, Inc. (NASDAQ: RMBS)|
|Moscone Convention Center|
|San Francisco, CA|
|Rambus participating in the ARM Connected Community booth #2414|
|June 7 11, 2015|
At the Design Automation Conference (DAC) 2015, the premier event for design and automation of electronic systems, Rambus will take part in multiple talks discussing low-power, high-performance memory and serial link solutions for mobile, consumer and enterprise applications. Rambus will also lead a session covering the unique requirements in designing secure chips. In addition, Rambus will be showcasing its high-performance, low-power solutions within the ARM Connected Community Pavilion. For additional details, visit www.rambus.com.
Rambus Participation at DAC:
Dates: Monday, June 8, 2015, 3:45 p.m. PDT and Tuesday, June 9, 2015, 10:45 a.m. PDT
Title: The Next Wave of Low-Power, High-Performance Mobile Memory
Focus: The increase in image capture, display resolution and frame rates continue to drive the need for more memory bandwidth and density in mobile devices. The latest high-end smartphones include LPDDR4 DRAM to deliver increased performance with reduced power consumption. This presentation will discuss advanced memory subsystems including the Rambus memory PHY with low-cost packaging, and its interface to the CoreLink DMC Memory Controller.
Speaker: Ajay Jain, director of product marketing, Rambus
Location: ARM connected Community Theater, booth# 2414
Dates: Tuesday, June 9, 2015, 2:30 p.m. PDT
Title: High-speed, Low-power Memory and Serial Links for Today s Consumer and Networking Applications
Focus: Increasing demands for mobile and cloud applications continue to drive the need for higher performance and improved power efficiency. Rambus has partnered with Samsung foundry to deliver best-in-class industry standard interfaces implemented in high-volume process technologies, providing robust solutions for a new generation of consumer and networking devices. This presentation will discuss how these market trends translate into requirements for high-speed memory and serial link interfaces and how the combination of Rambus IP and Samsung process offers considerable power and performance advantages to our mutual customers.
Speaker: Frank Ferro, senior director of product marketing, Rambus
Location: Samsung Electronics Booth, booth#933
Dates: Thursday, June 11, 2015, 4 p.m. PDT
Title: Special Session 69: The Lifecycle of Secure Chip Design
Focus: This session collects three talks that, taken together, describe the design lifecycle of a cryptographic chip. They highlight the unique requirements when designing secure chips that are subject to physical and logical threats, in particular when those chips may be physically reverse engineered.
Speaker: Megan Wachs, ASIC design engineering, Rambus Cryptography Research Division
Location: Room #300
About Rambus Inc.
Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.
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