The ModVIA™ plasma system by Nordson MARCH is a fully integrated, flexible system that doubles its capacity from 4 to 8 cells (8-16 panels) to easily accommodate manufacturing production growth. The ModVIA's compact design and small footprint save valuable floor space while delivering the same time-tested results and proven technology to treat printed circuit boards for desmear, etchback, and to provide surface activation. The new plasma system fits the needs of small- to medium-sized businesses or R&D institutions that process low-volume, high-mix products.
The ModVIA accommodates a broad array of PCB panel technologies in various shapes and sizes including rigid, flexible, through-hole, and blind via, and works with a wide range of process gases such as Ar, O2, N2, and CF4. Nominally equipped with three electronic mass flow controllers (MFCs) for optimal control and delivery, the gas system can support a total of five MFCs. The temperature-controlled high flux electrode (HFE) design, VIA series control system, and advanced plasma cleaning technology minimize CF4 usage, reduce cost of ownership, and produce PCBs with increased bonding performance and reduced electrical failures.
The chamber of the ModVIA is smaller -- 1652W x 1747D x 2445H mm (65W x 69D x 97H in.) - than other VIA systems, but everything else has been upgraded, from the gas distribution and pump package to the user interface and control parameters. The chamber processes the PCB panels in separate plasma cells to deliver high etch rates. The chassis houses the plasma chamber (which is constructed of high-quality aluminum for superior durability), the control electronics, 40 kHz RF generator, pump/blower package, and automatic matching network. Maintenance access is available from either front or rear access panels. The system is EH&S/Ergonomics compliant and CE marked.