LISLE, Ill.--Molex will feature its new Temp-Flex® Foam-Core Ultra-Low-Loss Coaxial Microwave Cable in booth 1911 at the IEEE 2016 International Microwave Symposium (IMS), to be held May 22 – 27 at The Moscone Center in San Francisco. Temp-Flex Foam-Core Cable combines space savings with an effective dielectric that eliminates “phase knee” and provides ease of termination. It also achieves 80% velocity of propagation (VOP) loss characteristics, which produces more reliable signal performance and lower loss characteristics than air-enhanced PTFE cable.
“The mechanical characteristics of Temp-Flex Foam-Core cable deliver high phase stability while still providing exceptionally low loss across the transmission line,” said Michael Ford, business development manager, Molex. “That makes it ideal for applications such as test and measurement, data and telecommunications, aerospace and defense, and medical equipment.”
With its thermally and mechanically stable dielectric, Temp-Flex Foam-Core Cable can withstand soldering temperatures to provide ease of termination. It is available in shielding ODs down to 1.194mm (0.047"), allowing it to be used in space-constrained applications. It also offers a shielding effectiveness better than 100 dB at high frequency, providing high RF noise immunity and low EMI.
For more information about RF/Microwave solutions from Molex, please visit www.molex.com/link/rfmicrowavecoax.html.
Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, industrial, automotive, commercial vehicle and medical. For more information, please visit www.molex.com.
Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other jurisdictions.