Teledyne Selects Berkeley Design Automation Analog FastSPICE Platform for Imaging Sensor Verification
8/7/2012 11:30:00 AM
Platform Delivers Nanometer SPICE Accuracy 5x to 10x Faster for Imaging Products
SANTA CLARA, Calif.--Berkeley Design Automation, Inc., provider ofthe world's fastest nanometer circuit verification, today announced that Teledyne Scientific & Imaging, LLC, a subsidiary of Teledyne Technologies Incorporated (NYSE:TDY), has selected the company's Analog FastSPICE (AFS) Platform for block-level characterization and full-circuit verification of theirimage sensor designs.
"We selected the AFS Platform because it providesnanometer SPICE accuracy 5x to 10x faster than traditional SPICE on a single core and full-spectrum device noise analysis for our image sensor designs."
"Teledyne Imaging Sensors designs and produces some of the most advanced focal plane arrays, sensors, and sub-systems covering a broad spectrum of light," said Jagmohan Bajaj, President, Teledyne Imaging Sensors. "We selected the AFS Platform because it provides nanometer SPICEaccuracy 5x to 10x faster than traditional SPICE on a single core and full-spectrum device noise analysis for our image sensor designs."
The Analog FastSPICE Platform provides the world's fastest circuit verification for nanometer analog, RF, mixed-signal, and custom digital circuits. Foundry certified to 20nm, the AFS Platform delivers nanometer SPICE accuracy 5x-10x faster on a single core and >2x faster on multicore systems versus any other simulator. For circuit characterization, the AFS Platform includes the industry's only comprehensive silicon-accurate device noise analysis and delivers near-linear performance scaling with the number of cores. For large circuits, it delivers >10M-element capacity, the fastest near-SPICE-accurate simulation, and the fastest, most accurate mixed-signal simulation. Available